An 820 pin PGA for ultra large-scale BiCMOS devices

Author

Hiruta, Y. ; Hirano, N. ; Itoh, Kenji ; Yamaji, Y. ; Kato, K. ; Motoyama, Y. ; Ohno, J. ; Homma, R. ; Kojima, S. ; Sudo, T.

Author_Institution

Semicond. Device Eng. Lab., Toshiba Corp., Kawasaki, Japan

fYear

1993

fDate

1-4 Jun 1993

Firstpage

396

Lastpage

404

Abstract

A high pin count, high performance PGA has been developed for next-generation ASIC devices which apply half-micron BiCMOS technology and have a maximum usable gate count of 300 K. In view of the advances in CMOS and BiCMOS ULSI technologies, high performance packages are required. This new package has been designed with due consideration of all package functions. Packages for high-end devices need to satisfy the following requirements: high electrical performance, low thermal resistance and high pin count in keeping with easy routing of PWB. The body size of the developed package is 60×60 mm². Surface mount type pin joint was adopted to realize high wiring density of a printed wiring board. This package has 820 pins with 50 mil pitch, and 5 rows. A small pin diameter of 0.2 mm and a short pin length of 3.0 mm were used for surface mounting

Keywords

BiCMOS integrated circuits; VLSI; application specific integrated circuits; integrated circuit technology; packaging; surface mount technology; thermal resistance; 0.2 mm; 3.0 mm; 50 mil; 60 mm; ASIC devices; PGA; body size; high-end devices; maximum usable gate count; package functions; pin count; pin diameter; pin length; surface mount type pin joint; thermal resistance; ultra large-scale BiCMOS devices; wiring density; Application specific integrated circuits; BiCMOS integrated circuits; CMOS technology; Electric resistance; Electronics packaging; Immune system; Large-scale systems; Thermal resistance; Ultra large scale integration; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1993. Proceedings., 43rd

Conference_Location

Orlando, FL

Print_ISBN

0-7803-0794-1

Type

conf

DOI

10.1109/ECTC.1993.346816

Filename

346816