DocumentCode :
2307318
Title :
Effectors of high temperature reliability in epoxy encapsulated devices
Author :
Gallo, A.A.
Author_Institution :
Dexter Electron. Mater., Dexter Corp., Olean, NY
fYear :
1993
fDate :
1-4 Jun 1993
Firstpage :
356
Lastpage :
366
Abstract :
Ball shear testing of devices encapsulated with a variety of molding compounds after aging at either 200°C/dry or 158°C/85% R.H. has shown comparable or faster failure rates for the 158°C/85% R.H. parts than for the 200°C/dry parts, in most cases. Slight or no corrosion of the bond pad was observed under either of these conditions, suggesting that loss of ball shear strength with wet aging (like dry aging) results from chemical weakening of the ball/intermetallic interface. Molding compounds without Sb2O3, and containing an ion scavenger performed the best. Electrical testing was also carried out on three different types of logic devices with either pure aluminum, aluminum+copper, or aluminum+copper+silicon metallization, built with three different molding compounds and three different die attach materials, under the more traditional high temperature (190°C) dry conditions (High Temperature Storage Life Test). The most improved reliability found was for devices with pure aluminum pad metallization encapsulated with non-Sb2O3 molding compounds of high catalyst level and using a low Cl ion die attach. Among the identified effectors of high temperature reliability, the presence of moisture and the type of molding compound used, are the most important
Keywords :
ageing; circuit reliability; encapsulation; failure analysis; 158 degC; 200 degC; Sb2O3; ball shear testing; ball/intermetallic interface; die attach; dry aging; epoxy encapsulated devices; failure rates; high temperature reliability; ion scavenger; metallization; moisture; molding compounds; wet aging; Aging; Aluminum; Corrosion; Life testing; Logic testing; Material storage; Materials testing; Metallization; Microassembly; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
Type :
conf
DOI :
10.1109/ECTC.1993.346820
Filename :
346820
Link To Document :
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