Mechanical and materials modeling/simulation/verification trend for electronics packaging products

Theoretical modeling and simulation have been used to address stress/strain related issues in microelectronics packages. Over time, the emphasis has moved from the problem solving mode to the predictive mode. With ever shrinking development schedules, the need to verify the validity of these models has become increasingly important. Although numerical modeling tools and algorithms have improved significantly over the years, recent advances in micromechanical and photomechanical tools have been the key in verifying the model leading to an enhanced and realistic model. This paper reviews some of the latest developments in micromechanical and photomechanical devices with up to 20 nm displacement sensitivity capability. Several examples of their implementation in an electronics packaging development environment will be presented. These verification tools lead to more accurate and realistic models, which in turn, facilitate design optimization at an early stage