Title :
Reliability of 0.4 mm pitch, 256-pin plastic quad flat pack no-clean and water-clean solder joints
Author :
Lau, John ; Pao, Yi-Hsin ; Larner, C. ; Govila, Ratan ; Twerefour, S. ; Gilbert, David ; Erasmus, S. ; Dolot, Stan
Author_Institution :
Hewlett-Packard Co., Palo Alto, CA, USA
Abstract :
The reliability of 0.4 mm pitch, 28 mm body size, 256-Pin Plastic Quad Flat Pack (QFP) no-clean and water-clean solder joints has been studied by temperature cycling and analytical analysis. The temperature cycling test was run non-stop for more than 6 months, and the results have been presented as a Weibull distribution. A unique temperature cycling profile has been developed based on the calculated lead stiffness, elastic and creep strains in the solder joint, and solder data. Also, the thermal fatigue life of the solder joints has been estimated and correlated with experimental results. Furthermore, a failure analysis of the solder joints has been performed using Scanning Electron Microscopy (SEM). Finally, a quantitative comparison between the no-clean and water-clean QFP solder joints has been presented
Keywords :
circuit reliability; deformation; failure analysis; life testing; printed circuit manufacture; printed circuit testing; scanning electron microscope examination of materials; soldering; statistical analysis; surface mount technology; surface treatment; thermal stress cracking; 0.4 mm; PCB mounted SMD; SEM; SMT; Weibull distribution; creep strain; elastic strain; failure analysis; fine pitch components; lead stiffness; no-clean solder joints; plastic QFP; plastic quad flat pack; reliability; scanning electron microscopy; temperature cycling; temperature cycling profile; thermal fatigue life; water-clean solder joints; Capacitive sensors; Creep; Electronics packaging; Lead; Plastics; Scanning electron microscopy; Soldering; Temperature distribution; Testing; Weibull distribution;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346854
