Title :
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC ´93)
Abstract :
The following topics are dealt with: advanced system level packaging; interconnection reliability; component and module reliability; manufacturing technology; polymer-enhanced interconnections; thermal/mechanical modeling; material processes and characterization; organic materials reliability; single chip packaging; connectors for modules and cards; assembly and cost-effective solutions for optoelectronics; electrical package design; metallization and printed wiring board processes; thermal and mechanical effects on reliability; solder joint modeling and performance; hybrid-MCM (multichip module)-C applications; high-performance MCM technology; novel solder materials; electrical packaging simulation
Keywords :
circuit analysis computing; electric connectors; electronic equipment manufacture; hybrid integrated circuits; integrated circuit technology; metallisation; multichip modules; optoelectronic devices; packaging; printed circuits; reliability; soldering; thermal analysis; MCM-C; component reliability; connectors; electrical package design; electrical packaging simulation; high-performance MCM technology; hybrids; interconnection reliability; manufacturing technology; material processes; mechanical modelling; metallization; module reliability; optoelectronics; organic materials reliability; polymer-enhanced interconnections; printed wiring board processes; single chip packaging; solder joint modeling; solder materials; system level packaging; thermal modelling;
Conference_Titel :
Electronic Components and Technology Conference, 1993. Proceedings., 43rd
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-0794-1
DOI :
10.1109/ECTC.1993.346861
