DocumentCode
2308279
Title
An optimized teflon bonding process for solar cell assemblies using Pilkington CMZ and CMG coverglasses
Author
Mullaney, K. ; Dollery, A.A. ; Jones, G.M. ; Bogus, K.
Author_Institution
Pilkington Space Technol., Bodelwyddan, UK
fYear
1993
fDate
10-14 May 1993
Firstpage
1392
Lastpage
1398
Abstract
Attempts at teflon bonding have always failed due to the mismatch of thermal coefficients of expansion. With the advent of the Pilkington CMZ and CMG coverglasses where the coefficients have been exactly matched to the solar cell material, the bonding process has been developed so that the advantages and disadvantages of teflon bonding may be evaluated for use in the space environment. One important advantage is that teflon lends itself to the incorporation of a device which limits the build up of electrical potential so that damaging electrostatic discharges do not take place. Concepts for ESD protection are given with the results of the preliminary performance and environmental tests
Keywords
adhesion; electrostatic discharge; photovoltaic power systems; protection; semiconductor device testing; solar cells; space vehicle power plants; ESD protection; Pilkington CMG coverglasses; Pilkington CMZ coverglasses; electrical potential; electrostatic discharges; environmental tests; optimized teflon bonding process; solar cell assemblies; thermal coefficients matching; Assembly; Bonding processes; Delamination; Photovoltaic cells; Silicon; Temperature; Testing; Thermal expansion; Thermal stresses; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 1993., Conference Record of the Twenty Third IEEE
Conference_Location
Louisville, KY
Print_ISBN
0-7803-1220-1
Type
conf
DOI
10.1109/PVSC.1993.346913
Filename
346913
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