• DocumentCode
    2308279
  • Title

    An optimized teflon bonding process for solar cell assemblies using Pilkington CMZ and CMG coverglasses

  • Author

    Mullaney, K. ; Dollery, A.A. ; Jones, G.M. ; Bogus, K.

  • Author_Institution
    Pilkington Space Technol., Bodelwyddan, UK
  • fYear
    1993
  • fDate
    10-14 May 1993
  • Firstpage
    1392
  • Lastpage
    1398
  • Abstract
    Attempts at teflon bonding have always failed due to the mismatch of thermal coefficients of expansion. With the advent of the Pilkington CMZ and CMG coverglasses where the coefficients have been exactly matched to the solar cell material, the bonding process has been developed so that the advantages and disadvantages of teflon bonding may be evaluated for use in the space environment. One important advantage is that teflon lends itself to the incorporation of a device which limits the build up of electrical potential so that damaging electrostatic discharges do not take place. Concepts for ESD protection are given with the results of the preliminary performance and environmental tests
  • Keywords
    adhesion; electrostatic discharge; photovoltaic power systems; protection; semiconductor device testing; solar cells; space vehicle power plants; ESD protection; Pilkington CMG coverglasses; Pilkington CMZ coverglasses; electrical potential; electrostatic discharges; environmental tests; optimized teflon bonding process; solar cell assemblies; thermal coefficients matching; Assembly; Bonding processes; Delamination; Photovoltaic cells; Silicon; Temperature; Testing; Thermal expansion; Thermal stresses; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 1993., Conference Record of the Twenty Third IEEE
  • Conference_Location
    Louisville, KY
  • Print_ISBN
    0-7803-1220-1
  • Type

    conf

  • DOI
    10.1109/PVSC.1993.346913
  • Filename
    346913