Title :
Development of a 36 GHz millimeter-wave BGA package
Author :
Hongwei Liang ; Laskar, J. ; Hyslop, M. ; Panicker, R.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We present a 36 GHz ball grid array (BGA) package design and its experimental characterization. A novel wideband de-embedding technique has been developed for accurate characterization of the package. A hybrid model has been developed for the transition including the ball and via interconnection and is verified with the measurement data of a microstrip line test structure. The transition demonstrates an insertion loss better than 0.3 dB to 36 GHz. The performance is demonstrated by measuring an MMIC amplifier built on the package. Our results show that the BGA is a cost-effective solution for millimeter wave RFIC packaging.
Keywords :
MIMIC; MMIC amplifiers; ball grid arrays; integrated circuit interconnections; integrated circuit packaging; losses; microstrip lines; 36 GHz; MMIC amplifier; RFIC packaging; ball grid array; hybrid model; insertion loss; measurement data; microstrip line test structure; millimeter-wave BGA package; via interconnection; wideband de-embedding technique; Calibration; Coplanar waveguides; Electronics packaging; Integrated circuit interconnections; Microstrip; Millimeter wave communication; Millimeter wave measurements; Millimeter wave technology; Substrates; Testing;
Conference_Titel :
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5687-X
DOI :
10.1109/MWSYM.2000.860886
