DocumentCode
2309064
Title
Resonance and EMI in vertical multi-coupled coils for wireless power transfer (WPT) system
Author
Kong, Sunkyu ; Kim, Jonghoon J. ; Kim, Joungho
Author_Institution
Dept. of Electr. Eng., KAIST, Daejeon, South Korea
fYear
2012
fDate
10-11 May 2012
Firstpage
147
Lastpage
150
Abstract
Wireless power transfer (WPT) using magnetic resonance could provide much convenience and so there has been much commercial interests on WPT recently. In the near future, WPT technology is expected to be applied to various electronic devices with transceiver coils for WPT. The coils in different electronic devices for WPT, then, could cause interference on each other. These environments could make a resonance peak for maximum power to divide into several peaks, and have an effect on transferred power and electromagnetic interference (EMI). Therefore, it is needed to measure and analyze various cases for different number of coils in WPT systems. In this paper, we have measured a resonance in vertical multi-coupled coils in the case of tight magnetic coupling. And we have analyzed the transferred power with respect to resonances of vertical multi-coupled coils. We also have measured EMI in vertical multi-coupled coils and analyzed EMI in frequency domain with respect to resonances of vertical multi-coupled coils for WPT systems.
Keywords
coils; electromagnetic coupling; frequency-domain analysis; magnetic resonance; radio transceivers; radiofrequency interference; radiofrequency power transmission; EMI; WPT system; electromagnetic interference; electronic devices; frequency domain analysis; magnetic coupling; magnetic resonance; transceiver coils; vertical multicoupled coils; wireless power transfer system; Coils; Electromagnetic interference; Impedance; Inductance; Magnetic resonance; Wireless communication; Electromagnetic interferences; multi-coupled; resonances; vertical; wireless power transfer;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Workshop Series on Innovative Wireless Power Transmission: Technologies, Systems, and Applications (IMWS), 2012 IEEE MTT-S International
Conference_Location
Kyoto
Print_ISBN
978-1-4673-1777-1
Type
conf
DOI
10.1109/IMWS.2012.6215772
Filename
6215772
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