• DocumentCode
    2309280
  • Title

    A micro-fabrication compatible wiggler design scalable to sub-millimeter periods

  • Author

    Bluem, Hans ; Jackson, Robert H.

  • Author_Institution
    Maryland Univ., College Park, MD, USA
  • fYear
    1989
  • fDate
    0-0 1989
  • Firstpage
    53
  • Abstract
    Summary Form only given, as follows. An ultrashort linear wiggler design has been developed that is compatible with microfabrication techniques and is capable of producing uniform, multikilogauss fields at millimeter and submillimeter periods. The design evolved from a prototype wiggler that consists of a multiply counterwrapped copper winding around a series of iron pole pieces. The counterwrapping produces a number of benefits, including reduction of end effects, elimination of edge asymmetries, current multiplication, and elimination of stray fields and excessive inductance from long, unshielded current supply leads. This wiggler has good uniformity and gives excellent agreement with calculations using the two-dimensional finite-difference code POISSON. It was found that even better intrinsic uniformity (<0.2% based on code calculations) could be obtained by putting a large iron bus along the top of the wiggler. By scaling down all dimensions proportionately to the ratio of the lengths and reducing the current by a like amount, it is possible to attain fields in the small wiggler that are the same as those attainable in the larger-period wiggler. On the other hand, the power density scales unfavorably, increasing as the inverse square of the scaling factor. Cooling may be required for CW operation. This can easily be provided due to the wiggler´s small size and its construction geometry.<>
  • Keywords
    beam handling equipment; electromagnets; CW operation; Fe bus; POISSON; counterwrapping; current multiplication; edge asymmetries; end effects; excessive inductance; microfabrication techniques; multikilogauss fields; stray fields; ultrashort linear wiggler design; Electromagnets; Particle beam handling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1989. IEEE Conference Record - Abstracts., 1989 IEEE International Conference on
  • Conference_Location
    Buffalo, NY, USA
  • Type

    conf

  • DOI
    10.1109/PLASMA.1989.166004
  • Filename
    166004