DocumentCode
2309886
Title
Fully integrated micromachined capacitive switches for RF applications
Author
Park, J.Y. ; Kim, G.H. ; Chung, K.W. ; Bu, J.U.
Author_Institution
Mater. & Devices Lab., LG Corp. Inst. of Technol., Seoul, South Korea
Volume
1
fYear
2000
fDate
11-16 June 2000
Firstpage
283
Abstract
RF micromachined capacitive switches are newly designed and fabricated with various structural geometry of transmission line, hinge, and movable plate formed by using electroplating techniques, low temperature processes, and dry releasing techniques. In particular, Strontium Titanate Oxide (SrTiO/sub 3/) with high dielectric constant is investigated for high switching on/off ratio and on capacitance as a dielectric layer of an integrated capacitive switch. Achieved lowest actuation voltage of the fabricated switches is 8 volts. The fabricated switch has low insertion loss of 0.08 dB at 10 GHz, isolation of 42 dB at 5 GHz, on/off ratio of 600, and on capacitance of 50 pF respectively.
Keywords
MMIC; capacitance; dielectric thin films; electroplating; micromachining; micromechanical devices; microwave switches; sputter etching; 0.08 dB; 5 to 10 GHz; 50 pF; 8 V; MEMS; RF applications; STO dielectric layer; SrTiO/sub 3/; dry releasing techniques; electroplating techniques; high dielectric constant; hinge; integrated capacitive switches; low temperature processes; micromachined capacitive switches; movable plate; plasma etching; transmission line; Capacitance; Fasteners; Geometry; High-K gate dielectrics; Radio frequency; Strontium; Switches; Temperature; Titanium compounds; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location
Boston, MA, USA
ISSN
0149-645X
Print_ISBN
0-7803-5687-X
Type
conf
DOI
10.1109/MWSYM.2000.860979
Filename
860979
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