• DocumentCode
    2309886
  • Title

    Fully integrated micromachined capacitive switches for RF applications

  • Author

    Park, J.Y. ; Kim, G.H. ; Chung, K.W. ; Bu, J.U.

  • Author_Institution
    Mater. & Devices Lab., LG Corp. Inst. of Technol., Seoul, South Korea
  • Volume
    1
  • fYear
    2000
  • fDate
    11-16 June 2000
  • Firstpage
    283
  • Abstract
    RF micromachined capacitive switches are newly designed and fabricated with various structural geometry of transmission line, hinge, and movable plate formed by using electroplating techniques, low temperature processes, and dry releasing techniques. In particular, Strontium Titanate Oxide (SrTiO/sub 3/) with high dielectric constant is investigated for high switching on/off ratio and on capacitance as a dielectric layer of an integrated capacitive switch. Achieved lowest actuation voltage of the fabricated switches is 8 volts. The fabricated switch has low insertion loss of 0.08 dB at 10 GHz, isolation of 42 dB at 5 GHz, on/off ratio of 600, and on capacitance of 50 pF respectively.
  • Keywords
    MMIC; capacitance; dielectric thin films; electroplating; micromachining; micromechanical devices; microwave switches; sputter etching; 0.08 dB; 5 to 10 GHz; 50 pF; 8 V; MEMS; RF applications; STO dielectric layer; SrTiO/sub 3/; dry releasing techniques; electroplating techniques; high dielectric constant; hinge; integrated capacitive switches; low temperature processes; micromachined capacitive switches; movable plate; plasma etching; transmission line; Capacitance; Fasteners; Geometry; High-K gate dielectrics; Radio frequency; Strontium; Switches; Temperature; Titanium compounds; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest. 2000 IEEE MTT-S International
  • Conference_Location
    Boston, MA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-5687-X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2000.860979
  • Filename
    860979