Panel title: 3-D test —A new paradigm in semiconductor test

To start the session, researchers from Georgia Tech will present a target application—3-D Massively Parallel Processor with Stacked Memories. This device includes five layers including 64 processor cores, a large SRAM and three layers of an eDRAM subsystem. This device is being built at Global Foundries using their 130-nm six-metal bulk-Si process.