DocumentCode
2310044
Title
A new micromachined overlap CPW structure with low attenuation over wide impedance ranges
Author
Hong-Teuk Kim ; Sanghwa Jung ; Jae-Hyoung Park ; Chang-Wook Baek ; Yong-Kweon Kim ; Youngwoo Kwon
Author_Institution
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
Volume
1
fYear
2000
fDate
11-16 June 2000
Firstpage
299
Abstract
A new micromachined overlay CPW with the edges of the center conductor partially elevated and overlapped with the ground, is developed to achieve low loss over wide impedance ranges. Overlay CPW helped to reduce conductor loss by reducing field concentration and current crowding at the edges of the signal lines. It also offered a screening effect from the substrate losses by concentrating the electric field between the conductor plates. For comparison, three different CPW structures were simulated and fabricated on glass substrates. The overlay CPW showed the largest impedance range and the lowest loss. The overlay CPW using MEMS technology is a good candidate for a uniplanar transmission line medium at mm-wave frequencies.
Keywords
MIMIC; coplanar waveguides; integrated circuit interconnections; losses; micromachining; MEMS technology; attenuation; conductor loss; conductor plates; current crowding; field concentration; impedance range; impedance ranges; micromachined overlap CPW structure; mm-wave frequencies; screening effect; uniplanar transmission line medium; Attenuation; Conductors; Coplanar waveguides; Dielectric losses; Dielectric substrates; Glass; Impedance; Micromechanical devices; Proximity effect; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest. 2000 IEEE MTT-S International
Conference_Location
Boston, MA, USA
ISSN
0149-645X
Print_ISBN
0-7803-5687-X
Type
conf
DOI
10.1109/MWSYM.2000.860989
Filename
860989
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