• DocumentCode
    2310044
  • Title

    A new micromachined overlap CPW structure with low attenuation over wide impedance ranges

  • Author

    Hong-Teuk Kim ; Sanghwa Jung ; Jae-Hyoung Park ; Chang-Wook Baek ; Yong-Kweon Kim ; Youngwoo Kwon

  • Author_Institution
    Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
  • Volume
    1
  • fYear
    2000
  • fDate
    11-16 June 2000
  • Firstpage
    299
  • Abstract
    A new micromachined overlay CPW with the edges of the center conductor partially elevated and overlapped with the ground, is developed to achieve low loss over wide impedance ranges. Overlay CPW helped to reduce conductor loss by reducing field concentration and current crowding at the edges of the signal lines. It also offered a screening effect from the substrate losses by concentrating the electric field between the conductor plates. For comparison, three different CPW structures were simulated and fabricated on glass substrates. The overlay CPW showed the largest impedance range and the lowest loss. The overlay CPW using MEMS technology is a good candidate for a uniplanar transmission line medium at mm-wave frequencies.
  • Keywords
    MIMIC; coplanar waveguides; integrated circuit interconnections; losses; micromachining; MEMS technology; attenuation; conductor loss; conductor plates; current crowding; field concentration; impedance range; impedance ranges; micromachined overlap CPW structure; mm-wave frequencies; screening effect; uniplanar transmission line medium; Attenuation; Conductors; Coplanar waveguides; Dielectric losses; Dielectric substrates; Glass; Impedance; Micromechanical devices; Proximity effect; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest. 2000 IEEE MTT-S International
  • Conference_Location
    Boston, MA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-5687-X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2000.860989
  • Filename
    860989