Title :
Case study of scan chain diagnosis and PFA on a low yield wafer
Author :
Huang, Yu ; Benware, Brady ; Cheng, Wu-Tung ; Tai, Ting-Pu ; Kuo, Feng-Ming ; Chen, Yuan-Shih
Author_Institution :
Mentor Graphics Corp., Wilsonville, OR, USA
Abstract :
In this poster, we share our industrial experiences on running chain diagnosis and PFA (Physical Failure Analysis) on a wafer that suffered from low yield. In addition, case study on PFA will be illustrated.
Keywords :
boundary scan testing; failure analysis; fault diagnosis; integrated circuit testing; integrated circuit yield; PFA; industrial experiences; low yield wafer; physical failure analysis; scan chain diagnosis;
Conference_Titel :
Test Conference (ITC), 2010 IEEE International
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-7206-2
DOI :
10.1109/TEST.2010.5699310
