• DocumentCode
    2310193
  • Title

    Case study of scan chain diagnosis and PFA on a low yield wafer

  • Author

    Huang, Yu ; Benware, Brady ; Cheng, Wu-Tung ; Tai, Ting-Pu ; Kuo, Feng-Ming ; Chen, Yuan-Shih

  • Author_Institution
    Mentor Graphics Corp., Wilsonville, OR, USA
  • fYear
    2010
  • fDate
    2-4 Nov. 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    In this poster, we share our industrial experiences on running chain diagnosis and PFA (Physical Failure Analysis) on a wafer that suffered from low yield. In addition, case study on PFA will be illustrated.
  • Keywords
    boundary scan testing; failure analysis; fault diagnosis; integrated circuit testing; integrated circuit yield; PFA; industrial experiences; low yield wafer; physical failure analysis; scan chain diagnosis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference (ITC), 2010 IEEE International
  • Conference_Location
    Austin, TX
  • ISSN
    1089-3539
  • Print_ISBN
    978-1-4244-7206-2
  • Type

    conf

  • DOI
    10.1109/TEST.2010.5699310
  • Filename
    5699310
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2310193