• DocumentCode
    2310286
  • Title

    Transistor Count, Chip Area and Cost Optimization of Fault Tolerant Active Pixel Sensors (FTAPS) by Modified Sensor Architecture and T-spice Based Verification of Proposed Architecture

  • Author

    Ghosh, Debapriyo

  • Author_Institution
    Dept.of ETC, Bengal Eng. & Sci. Univ. (BESU), Shibpur, India
  • fYear
    2010
  • fDate
    12-13 March 2010
  • Firstpage
    200
  • Lastpage
    202
  • Abstract
    Pixel defects are unavoidable in many solid-state image sensors, especially, CMOS image sensors. The pixel defects includes Hot pixels, Partially-stuck pixels, Fully-stuck pixels, Abnormal sensitivity defects, Random Telegraph Signal defects. Among them the most common and significant is hot pixel defect. Many approaches have been proposed to counter the effects of hot pixel defect. They include the dark frame subtraction and Fault Tolerant Active Pixel Sensor (FTAPS). This paper focuses on transistor count optimization of fault tolerant APS to achieve Chip Area And Cost Optimization by proposing a new architecture for FTAPS. It also includes verification of the response of proposed pixel architecture using TSPICE based simulations.
  • Keywords
    CMOS image sensors; SPICE; CMOS image sensors; T-SPICE based verification; abnormal sensitivity defects; chip area; dark frame subtraction; fault tolerant active pixel sensors; fully-stuck pixels; hot pixels; modified sensor architecture; partially-stuck pixels; pixel defects; random telegraph signal defects; solid-state image sensors; transistor count optimization; CMOS image sensors; Computer architecture; Cost function; Dark current; Fault tolerance; Image processing; Image sensors; Lighting; Pixel; Telegraphy; APS; CCD Sensors; CMOS Image Sensors; FTAPS; Modified FTAPS Architecture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Recent Trends in Information, Telecommunication and Computing (ITC), 2010 International Conference on
  • Conference_Location
    Kochi, Kerala
  • Print_ISBN
    978-1-4244-5956-8
  • Type

    conf

  • DOI
    10.1109/ITC.2010.33
  • Filename
    5460535