• DocumentCode
    2310376
  • Title

    Realization of low profile high-impedance surfaces using an array of densely packed crossed metallic wires

  • Author

    Silveirinha, Mário G. ; Fernandes, Carlos A.

  • Author_Institution
    Univ. de Coimbra, Coimbra
  • fYear
    2007
  • fDate
    9-15 June 2007
  • Firstpage
    1337
  • Lastpage
    1340
  • Abstract
    In this work, we explore a different opportunity to design high-impedance surfaces. We suggest that an array of densely packed metallic wires properly distributed in a periodic lattice and embedded in a low-epsilon dielectric, may be used to synthesize a very compact high-impedance surface.
  • Keywords
    dielectric materials; wires (electric); densely packed crossed metallic wires; low profile high-impedance surfaces; low-epsilon dielectric; Dielectric substrates; Electromagnetic waveguides; Microstrip antenna arrays; Microstrip antennas; Microwave antenna arrays; Pins; Surface texture; Surface waves; Telecommunications; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2007 IEEE
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-0877-1
  • Electronic_ISBN
    978-1-4244-0878-8
  • Type

    conf

  • DOI
    10.1109/APS.2007.4395750
  • Filename
    4395750
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2310376