Title :
Crosstalk analysis of high-speed interconnects and packages
Author :
You, Hong ; Soma, Mani
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Abstract :
An approach to the crosstalk analysis of high-speed interconnects has been developed. The method yields closed-form expressions of the voltage and current transfer functions and time-domain signal waveforms. The results facilitate analytical evaluation of coupling noise, waveform distortion, and propagation delay due to crosstalk inherent in multiconductor interconnects. The method is applicable to the general problem of N coupled lossy and/or dispersive interconnects with arbitrary linear source/load impedances
Keywords :
crosstalk; packaging; transmission lines; closed-form expressions; coupling noise; crosstalk analysis; current transfer functions; dispersive interconnects; high-speed interconnects; load impedances; lossy interconnects; multiconductor interconnects; propagation delay; source impedances; time-domain signal waveforms; voltage transfer functions; waveform distortion; Coupling circuits; Crosstalk; Equations; Frequency; Impedance; Integrated circuit interconnections; Packaging; Transfer functions; Transmission line matrix methods; Voltage;
Conference_Titel :
Custom Integrated Circuits Conference, 1990., Proceedings of the IEEE 1990
Conference_Location :
Boston, MA
DOI :
10.1109/CICC.1990.124711
