DocumentCode :
2310521
Title :
Design of a Low Power Flip-Flop Using CMOS Deep Sub Micron Technology
Author :
Naik, Surya ; Chandel, Rajeevan
Author_Institution :
Electron. & Commun. Engg Dept, Lingayas Univ. Faridabad, Faridabad, India
fYear :
2010
fDate :
12-13 March 2010
Firstpage :
253
Lastpage :
256
Abstract :
This paper enumerates low power, high speed design of flip-flop having less number of transistors and only one transistor being clocked by short pulse train which is true single phase clocking (TSPC) flip-flop. Compared to Conventional flip-flop, it has 5 Transistors and one transistor clocked, thus has lesser size and lesser power consumption. It can be used in various applications like digital VLSI clocking system, buffers, registers, microprocessors etc. The analysis for various flip flops and latches for power dissipation and propagation delays at 0.13 ¿m and 0.35 ¿m technologies is carried out. The leakage power increases as technology is scaled down. The leakage power is reduced by using best technique among all run time techniques viz. MTCMOS. Thereby comparison of different conventional flip-flops, latches and TSPC flip-flop in terms of power consumption, propagation delays and product of power dissipation and propagation delay with SPICE simulation results is presented.
Keywords :
CMOS digital integrated circuits; SPICE; flip-flops; integrated circuit design; low-power electronics; CMOS deep submicron technology; MTCMOS; SPICE simulation; TSPC flip-flop; high speed design; latches; leakage power; low power flip-flop; power dissipation; propagation delays; short pulse train; single phase clocking; CMOS technology; Circuits; Clocks; Energy consumption; Flip-flops; Latches; Leakage current; Power dissipation; Threshold voltage; Transistors; CMOS; TSPC flip-flop; delay; figure of merit; leakage current; power;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Recent Trends in Information, Telecommunication and Computing (ITC), 2010 International Conference on
Conference_Location :
Kochi, Kerala
Print_ISBN :
978-1-4244-5956-8
Type :
conf
DOI :
10.1109/ITC.2010.100
Filename :
5460551
Link To Document :
بازگشت