Title :
Application of ultraviolet laser in high density interconection micro blind via
Author :
Long, Faming ; He, Wei ; Chen, Yuanming ; Wang, Yanyan ; Hu, Ke ; He, Bo ; Mo, Yunqi
Author_Institution :
Key Lab. of Electron. Thin Films & Integrated Devices, UESTC, Chengdu, China
Abstract :
The micro blind via drilling process is one of the crucial problems in the manufacture of high density interconnection printed circuit boards (HDI PCB). The main effect factors, which are the technological parameters of drilling process, were discussed in details by conducting an orthogonal experimental design (OED) study. The test result of the metallographic slicing tester show that the designed micro blind via has been obtained with above OED technological parameters. The regression equations between via depth and drill parameters have been obtained by Minitab Statistical Analysis Software. Precise control for blind via drilling can be realized by the regression equations.
Keywords :
drilling; integrated circuit interconnections; lasers; metallography; printed circuits; regression analysis; Minitab Statistical Analysis Software; OED technological parameters; drill parameters; high density interconection microblind via; high density interconnection; metallographic slicing tester; microblind via drilling process; orthogonal experimental design; printed circuit boards; regression equations; ultraviolet laser; Copper; Drilling; Equations; Helium; Power lasers; HDI (high density interconnection); Micro blind via; Orthogonal experimental design (OED); UV laser;
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2010.5699470