Application of ultraviolet laser in high density interconection micro blind via

The micro blind via drilling process is one of the crucial problems in the manufacture of high density interconnection printed circuit boards (HDI PCB). The main effect factors, which are the technological parameters of drilling process, were discussed in details by conducting an orthogonal experimental design (OED) study. The test result of the metallographic slicing tester show that the designed micro blind via has been obtained with above OED technological parameters. The regression equations between via depth and drill parameters have been obtained by Minitab Statistical Analysis Software. Precise control for blind via drilling can be realized by the regression equations.