DocumentCode
2311130
Title
Performance evaluation of deterministic flow lines: Redundant modules and application to semiconductor manufacturing equipment
Author
Park, Kyungsu ; Morrison, James R.
Author_Institution
Dept. of Ind. & Syst. Eng., KAIST, Daejeon, South Korea
fYear
2010
fDate
21-24 Aug. 2010
Firstpage
45
Lastpage
50
Abstract
Fab level simulation is often used to evaluate the performance of control policies, capacity changes, mix/volume changes and design decisions in semiconductor wafer manufacture. As cluster and multi-cluster tools, such as the linked photolithography tool, are of increasing prominence in semiconductor wafer manufacture, it is important to have expressive and efficient models of these tools for use in fab-level simulation. Existing models are either too detailed for practical use or do not include key features such as the nonlinearity of tool cycle time as a function of the number of wafers per lot. To address these issues, we develop theory for the wafer exit time from a flow line with parallel servers at each process and extend it for practical application. We use the max-plus algebra to obtain an upper bound for the wafer completion times which requires less computation than full flow line simulation. We conjecture that the bound is exact; all cases studied show this to be true. Our conjectured exit time expression is independent of the order of the servers. We use our expression to develop equipment models for fab level simulation. We conduct numerical experiments that show the models are computationally efficient.
Keywords
algebra; integrated circuit manufacture; performance evaluation; photolithography; semiconductor industry; semiconductor technology; wafer bonding; deterministic flow lines; fab level simulation; linked photolithography tool; maxplus algebra; multicluster tools; performance evaluation; redundant modules; semiconductor manufacturing equipment; semiconductor wafer manufacture; wafer completion times; wafer exit time; Computational modeling; Equations; Mathematical model; Numerical models; Semiconductor device modeling; Servers;
fLanguage
English
Publisher
ieee
Conference_Titel
Automation Science and Engineering (CASE), 2010 IEEE Conference on
Conference_Location
Toronto, ON
Print_ISBN
978-1-4244-5447-1
Type
conf
DOI
10.1109/COASE.2010.5584593
Filename
5584593
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