• DocumentCode
    2311294
  • Title

    Bumping technology and chip & package interaction

  • Author

    Tsukada, Yoshinori

  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    43
  • Keywords
    flip-chip devices; packaging; bumping technology; chip-package interaction; flip chip packaging; Arrays; Attenuation; Flip chip; Inductance; Joints; Packaging; Switching circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699495
  • Filename
    5699495
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2311294