DocumentCode
2311315
Title
Updated results of R&D on Functionally Innovative 3D-Integrated Circuit (Dream Chip) technology in FY2009
Author
Kada, Morihiro
Author_Institution
Association of Super-Advanced Electronics Technologies
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
2
Abstract
In the NEDO "Dream Chip Project", ASET has been entrusted a project for developing, "Functionally Innovative 3D-Integrated Circuit". In the five year project from 2008 to 2012, development on technologies for design environment, chip test, interposer, cooling and stacking/bonding, thin wafer, and development on demonstration device, process and 3D Reconfigurable Device Technology are being performed.
Keywords
cooling; integrated circuit testing; three-dimensional integrated circuits; 3D reconfigurable device technology; Dream Chip; bonding; chip test; cooling; design environment; functionally innovative 3D-integrated circuit technology; interposer; stacking; thin wafer; Bonding; Cooling; Integrated circuit modeling; Performance evaluation; Stacking; Three dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699496
Filename
5699496
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