Title :
Updated results of R&D on Functionally Innovative 3D-Integrated Circuit (Dream Chip) technology in FY2009
Author_Institution :
Association of Super-Advanced Electronics Technologies
Abstract :
In the NEDO "Dream Chip Project", ASET has been entrusted a project for developing, "Functionally Innovative 3D-Integrated Circuit". In the five year project from 2008 to 2012, development on technologies for design environment, chip test, interposer, cooling and stacking/bonding, thin wafer, and development on demonstration device, process and 3D Reconfigurable Device Technology are being performed.
Keywords :
cooling; integrated circuit testing; three-dimensional integrated circuits; 3D reconfigurable device technology; Dream Chip; bonding; chip test; cooling; design environment; functionally innovative 3D-integrated circuit technology; interposer; stacking; thin wafer; Bonding; Cooling; Integrated circuit modeling; Performance evaluation; Stacking; Three dimensional displays; Through-silicon vias;
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2010.5699496
