• DocumentCode
    2311320
  • Title

    Ultra fine pitch flip chip interconnection for 3D integration

  • Author

    Orii, Y.

  • Author_Institution
    IBM Res. Tokyo, Tokyo, Japan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    24
  • Keywords
    fine-pitch technology; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; 3D integration; IMC bonding; chip connection technology; fine pitch flip chip interconnection; pre-applied interchip fill; Arrays; Cellular phones; Flip chip; Laminates; Mobile communication; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699497
  • Filename
    5699497
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2311320