DocumentCode :
2311326
Title :
New generation underfills for advanced IC packages
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
18
Keywords :
ball grid arrays; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; multichip modules; 3D thru-silicon-via technology; flip chip ball grid arrays; multichip packages; vacuum underfilling technology; Encapsulation; Glass; Memory management; Power demand; Reliability; Three dimensional displays; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699498
Filename :
5699498
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2311326
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