DocumentCode
2311400
Title
Advanced solutions for 3D integration of heterogeneous individual chips
Author
Poupon, G.
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
50
Keywords
bonding processes; fine-pitch technology; integrated circuit interconnections; system-on-chip; three-dimensional integrated circuits; wafer level packaging; 3D integration; 3D wafer level packaging; CIWIS process; SOC; active silicon interposer; chip in wafer for integrated system; conference presentation; direct bonding techniques; embedded chip technology; embedded wafer level packaging; fine pitch TSV; heterogeneous individual chips; high density TSV; high density interconnects; molecular bonding; packaging trends; silicon interposer technology; silicon mother board; via belt technology; Copper; Face; Micromechanical devices; Silicon; System-on-a-chip; Three dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699502
Filename
5699502
Link To Document