DocumentCode :
2311472
Title :
Vapor chamber in high power LEDs
Author :
Wang, Jung-Chang ; Huang, Chun-Ling
Author_Institution :
Dept. of Marine Eng., Nat. Taiwan Ocean Univ., Keelung, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
The vapor chamber has already been confirmed that its anti-gravity, high effective thermal conductivity and suited on the high heat flux of heat source as the integral heat spreader. This article describes how to evaluate the thermal-performance of LED vapor chamber-based plate with VCTM V1.0, which has existed in the thermal-module industry for a year or so especially in high power LEDs application. There are three kinds of LED based plates utilized to discuss the thermal performance and illumination. From the results, the thermal performance of the LED vapor chamber-based plate is many times than that of LED copper- and aluminum-based plate. And the LED vapor chamber-based plate works out hot-spot problem of 50 Watt high-power LEDs, successfully. The results are shown that the experimental thermal resistance values of LED copper- and vapor chamber-based plate respectively are 0.41°C/W and 0.38°C/W at 6 Watt. And the illumination of 6 Watt LED vapor chamber-based plate is larger 5 % than the 6 Watt. Thus, the LED vapor chamber-based plate has the best thermal performance above 5 Watt.
Keywords :
chemical vapour deposition; light emitting diodes; lighting; thermal conductivity; LED; VCTM VI.0; heat flux; heat source; illumination; integral heat spreader; power 50 W; power 6 W; thermal performance; thermal-module industry; vapor chamber; Aluminum; Conductivity; Copper; Heating; Light emitting diodes; Thermal conductivity; Effective Thermal Conductivity; Hot-Spot; Server High-Power LEDs; VCTM V1.0; Vapor Chamber;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699507
Filename :
5699507
Link To Document :
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