Thermo-mechanical analysis of thermoelectric modules

Author

Li, Sheng-Liang ; Liu, Chun-Kai ; Hsu, Chung-Yen ; Hsieh, Ming-Che ; Dai, Ming-Ji ; Wu, Sheng-Tsai

Author_Institution

Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan

fYear

2010

fDate

20-22 Oct. 2010

Firstpage

1

Lastpage

4

Abstract

The present paper studies the thermo-mechanical performance of thermoelectric modules by utilizing the Finite Element Analysis FEA simulation software ANSYS. A typical type TEG device with 32 pairs of legs was constructed. Three different thickness for the pads with 100um, 500um, and 1000um were given for investigating the geometry effect. The thermo-electric results got well confirmed compared with analytical solution. The maximum Von Mises stress occurs on the contact surface between top pad and top substrate due to the large CTE mismatch between the copper pad and the AlN substrate, especially in the higher temperature case. This stress might lead to module failure and reduce the reliability.

Keywords

finite element analysis; thermoelectric conversion; thermoelectric devices; AIN substrate; ANSYS; FEA; TEG device; Von Mises stress; finite element analysis; geometry effect; size 100 mum; size 1000 mum; size 500 mum; thermo-mechanical performance; thermoelectric modules; Conductivity; Copper; Finite element methods; Stress; Substrates; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4244-9783-6

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2010.5699512

Filename

5699512