• DocumentCode
    2311609
  • Title

    Which Spot Should I Test for Effective Embedded Software Testing?

  • Author

    Seo, Jooyoung ; Ki, Yuhoon ; Choi, Byoungju ; La, Kwanghyun

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Ewha Univ., Seoul
  • fYear
    2008
  • fDate
    14-17 July 2008
  • Firstpage
    135
  • Lastpage
    142
  • Abstract
    Today, the embedded industry is changing fast - systems have become larger, more complex, and more integrated. Embedded system consists of heterogeneous layers such as hardware, HAL, device driver, OS kernel, and application. These heterogeneous layers are usually customized for special purpose hardware. Therefore, various hardware and software components of embedded system are mostly integrated together under unstable status. That is, there are more possibilities of faults in all layers unlike package software.In this paper, we propose the embedded software interface as two essential parts: interface function that represents the statement of communication between heterogeneous layers, and interface variable that represents software and/or hardware variable which are defined in different layer from integrated software and used to expected output for decision of fault. Also, we statically investigate various views of embedded software interface and demonstrate that proposed interface should be new criterion for effective embedded software testing.
  • Keywords
    device drivers; embedded systems; operating system kernels; program testing; OS kernel; device driver; embedded industry; embedded software interface; embedded software testing; embedded system; Embedded software; Embedded system; Fault detection; Fault diagnosis; Hardware; Packaging; Software packages; Software performance; Software testing; System testing; Embedded software testing; embedded software interface; empirical studies; integration testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Secure System Integration and Reliability Improvement, 2008. SSIRI '08. Second International Conference on
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-0-7695-3266-0
  • Electronic_ISBN
    978-0-7695-3266-0
  • Type

    conf

  • DOI
    10.1109/SSIRI.2008.38
  • Filename
    4579805