The challenges of copper wire bonding

Advantages of Cu wire bonding, such as less wire sweep, better performance for analog devices, are interpreted by its material properties. Alternative aspect from material properties on Cu wire bonding parameters is proposed to reflect the fact that Cu wire bonding may not necessarily damage the existing under-pad structure of integrated circuit designed for Au wire bonding. The challenge of Cu wire bonding is its process window needs to be tightened than Au wire bonding. The corrosion mechanism of Cu-Al EVlCs is yet clear, the selection of molding compound become critical to achieve longer life for Cu wire bonded devices in terms of IMC corrosion.