• DocumentCode
    2311770
  • Title

    Low cost hot embossing process for plastics microfluidic chips fabrication

  • Author

    Lomas, T. ; Mongpraneet, S. ; Wisitsoraat, A. ; Jaruwongrungsee, K. ; Sappat, A. ; Maturos, T. ; Chevasuvit, F. ; Tuantranont, Adisorn

  • Author_Institution
    Nanoelectron. & MEMS Lab., Nat. Electron. & Comput. Technol. Center, Pathumthani, Thailand
  • fYear
    2009
  • fDate
    6-9 May 2009
  • Firstpage
    462
  • Lastpage
    464
  • Abstract
    In this work, we develop plastic microfluidic chips based on low cost hot embossing process with metal micromold. Metal micromold was formed on aluminum substrates by CNC milling machine and high precision micromachine. The hot embossing system is in-house made with computer aid design by Solid Work program. The system consists of four main parts, structural body, heating system, compressive system and control electronics. The compressive system consists of two top hydraulic single-stage pistons and four middle-stage pistons. Polymethyl methacrylate (PMMA) microfluidic chips were then produced by hot embossing under different applied temperatures and time. It was found that optimum temperature and time for minimum contraction and depth error were 80 degree C and 2-5 minutes. The developed technique offer advantages for microfluidic chip fabrication in term of quality, complexity and cost.
  • Keywords
    CAD; bioMEMS; biomedical engineering; computerised numerical control; embossing; hot working; microfluidics; micromachining; milling; moulding; production engineering computing; CNC milling machine; biomedical engineering; compressive system; computer aid design; heating system; high precision micromachine; hot embossing process; metal micromold; plastics microfluidic chips fabrication; Aluminum; Chip scale packaging; Computer numerical control; Costs; Embossing; Metalworking machines; Microfluidics; Pistons; Plastics; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, 2009. ECTI-CON 2009. 6th International Conference on
  • Conference_Location
    Pattaya, Chonburi
  • Print_ISBN
    978-1-4244-3387-2
  • Electronic_ISBN
    978-1-4244-3388-9
  • Type

    conf

  • DOI
    10.1109/ECTICON.2009.5137048
  • Filename
    5137048