Title :
Effect of Creep Properties on Pressure Induced Tin Whisker Formation
Author :
Shibutani, Tadahiro ; Yu, Qiang ; Shiratori, Masaki
Author_Institution :
Yokohama Nat. Univ., Yokohama
Abstract :
This paper presents the effect of creep properties on pressure-induced tin whisker formation. Creep properties of bright SnPb and SnCu finishes were evaluated by using a nanoindentation test. At the early stage of indentation, power law creep has a small scatter in both plating finishes. On the other hands, diffusion creep in SnCu show big scatter than SnPb. This behavior can explain the whisker formation on SnCu.
Keywords :
copper alloys; diffusion creep; indentation; lead alloys; tin alloys; whiskers (crystal); SnCu; SnPb; creep properties; diffusion creep; nanoindentation test; power law; pressure induced tin whisker formation; Acceleration; Compressive stress; Conductors; Connectors; Creep; Environmentally friendly manufacturing techniques; Power engineering and energy; Reliability engineering; Scattering; Tin; creep; lead-free; pressure; tin whisker; tin-copper; tin-lead;
Conference_Titel :
Secure System Integration and Reliability Improvement, 2008. SSIRI '08. Second International Conference on
Conference_Location :
Yokohama
Print_ISBN :
978-0-7695-3266-0
Electronic_ISBN :
978-0-7695-3266-0
DOI :
10.1109/SSIRI.2008.25
