• DocumentCode
    2312048
  • Title

    Performance tests on a novel vapor chamber using water, methanol or acetone as the working fluid

  • Author

    Wong, Shwin-Chung ; Huang, Siao-Fang ; Hsieh, Kuo-Chun

  • Author_Institution
    Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Experiments on vapor chamber performance with working fluid of water, methanol and acetone, respectively, were conducted using our novel vapor chambers. Water has remarkably larger latent heat and surface tension, and acetone has similar surface tension as methanol but smallest latent heat. A sintered two-layer 100+200 mesh wick was adopted, and the volumetric fluid charges were the same. The footprint of the vapor chamber was 90 mm ×100 mm. The vapor chamber was loaded at its central bottom with a dummy heater of 1.1 × 1.1, 2.1 × 2.1 or 3.1 × 3.1 cm2. The thermal resistances of the vapor chamber were determined according to the heat load and the temperature difference between the bottom plate and the heat sink base. As far as the maximum heat load is concerned, water presents the largest and acetone the smallest, in the same sequence of their figures of merit. However, the differences are not as distinct as in their figures of merit. As for the minimum vapor chamber resistances, water presents the smallest value and acetone the largest, as acetone presents the largest average evaporating film thickness due to its small surface tension. The differences are more pronounced than those in the evaporation resistances measured in a conventional plat-plate heat pipe. For all three working fluids, the minimum vapor chamber resistances strongly decreased with increasing heated area. For sufficiently large heated area, this can be mainly attributed to a smaller average evaporating film thickness for a larger evaporation area.
  • Keywords
    cooling; heat sinks; surface tension; thermal management (packaging); thermal resistance; acetone; bottom plate; dummy heater; evaporation resistance; heat sink base; latent heat; maximum heat load; methanol; plat-plate heat pipe; surface tension; temperature difference; thermal resistance; vapor chamber performance; vapor chamber resistance; volumetric fluid charge; water; working fluid; Films; Fluids; Methanol; Resistance heating; Temperature measurement; Water heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699540
  • Filename
    5699540