DocumentCode :
2312085
Title :
Direct plated copper metallized substrate for high brightness LED applications
Author :
Chiu, Mao-Ching
Author_Institution :
Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
32
Keywords :
ceramics; conductors (electric); copper; light emitting diodes; microwave devices; power semiconductor devices; semiconductor device metallisation; thermal management (packaging); Cu; RF device; ceramic substrate; cooper conductor; dense memory stacks; direct plated copper; high brightness LED; high current application; metallized substrate; microwave device; power semiconductors; thermal demand applications; very high power application;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699544
Filename :
5699544
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2312085
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