DocumentCode :
2312094
Title :
DPC on silicon for next generation high power packaging applications
Author :
Lin, Vito
Author_Institution :
R&D Dept., Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
19
Keywords :
electronics packaging; power electronics; silicon; DPC; direct plating copper; high power packaging applications; silicon; Aluminum oxide; Electronic packaging thermal management; Packaging; Silicon; Substrates; Thermal conductivity; Thermal expansion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699545
Filename :
5699545
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2312094
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