• DocumentCode
    2312094
  • Title

    DPC on silicon for next generation high power packaging applications

  • Author

    Lin, Vito

  • Author_Institution
    R&D Dept., Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    19
  • Keywords
    electronics packaging; power electronics; silicon; DPC; direct plating copper; high power packaging applications; silicon; Aluminum oxide; Electronic packaging thermal management; Packaging; Silicon; Substrates; Thermal conductivity; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699545
  • Filename
    5699545
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2312094