Title :
High-performance microwave power AlInAs/GaInAs/InP double heterojunction bipolar transistors with compositionally graded base-collector junction
Author :
Hafizi, M. ; Liu, T. ; Macdonald, P.A. ; Lui, M. ; Chu, P. ; Rensch, D.B. ; Stanchina, W.E. ; Wu, C.S.
Author_Institution :
Hughes Res. Labs., Malibu, CA, USA
Abstract :
We report, for the first time, on the use of compositional grading at the base-collector (B-C) junction of AlInAs/GaInAs/InP double heterojunction bipolar transistors (HBT) to achieve high-performance devices for microwave power and analog circuit applications. To overcome the conduction band potential barrier at the B-C junction, we have inserted an n-GaInAs spacer and a novel 100 nm compositional grade between the GaInAs base and the wide bandgap InP Collector. A base-collector breakdown voltage of 32 V, collector-emitter breakdown voltage of 26 V, and a f/sub max/ of 93 GHz have been achieved. Preliminary power measurements at 10 GHz on 240 /spl mu/m/sup 2/ emitter DHBT´s resulted in over 5 W/mm output power at a collector bias of 10 V.<>
Keywords :
III-V semiconductors; MMIC; aluminium compounds; bipolar integrated circuits; electric breakdown of solids; gallium arsenide; heterojunction bipolar transistors; indium compounds; linear integrated circuits; power integrated circuits; power transistors; solid-state microwave devices; 10 GHz; 26 V; 32 V; AlInAs-GaInAs-InP; AlInAs/GaInAs/InP; DHBTs; analog circuit applications; base-collector breakdown voltage; collector bias; collector-emitter breakdown voltage; compositionally graded base-collector junction; conduction band potential barrier; double heterojunction bipolar transistors; high-performance devices; microwave power applications; Analog circuits; Breakdown voltage; DH-HEMTs; Double heterojunction bipolar transistors; Gallium arsenide; Heterojunction bipolar transistors; Indium phosphide; Low voltage; Microwave devices; Power measurement;
Conference_Titel :
Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-1450-6
DOI :
10.1109/IEDM.1993.347195