Title :
Miniature image sensor package
Author_Institution :
Market Dept., Tong Hsing Electron. Ind., Ltd., Taiwan
Keywords :
image sensors; process design; miniature image sensor package; process design;
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2010.5699548