DocumentCode :
2312164
Title :
Thick film hybrid technology for automotive applications
Author :
Lu, Bao-Liang
Author_Institution :
Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
34
Keywords :
automotive components; automotive electronics; bonding processes; ignition; thick film circuits; thick film resistors; air bag controller; automotive circuit; automotive electronics; dielectric layer; gold conductor layer; hybrid circuit fabrication; ignition control modules; mass airflow sensor; metal alloying; thick film bonding; thick film conductor firing process; thick film hybrid technology; thick film resistor; Bonding; Ceramics; Conductors; Electronic mail; Electronics industry; Resistors; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699549
Filename :
5699549
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2312164
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