DocumentCode
2312164
Title
Thick film hybrid technology for automotive applications
Author
Lu, Bao-Liang
Author_Institution
Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
34
Keywords
automotive components; automotive electronics; bonding processes; ignition; thick film circuits; thick film resistors; air bag controller; automotive circuit; automotive electronics; dielectric layer; gold conductor layer; hybrid circuit fabrication; ignition control modules; mass airflow sensor; metal alloying; thick film bonding; thick film conductor firing process; thick film hybrid technology; thick film resistor; Bonding; Ceramics; Conductors; Electronic mail; Electronics industry; Resistors; Thick films;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699549
Filename
5699549
Link To Document