DocumentCode

2312217

Title

Compression mold development for multiple propose applications

Author

Tin-Huei Dong

Author_Institution

Tong Hsing Electron. Ind., Ltd., Taipei, Taiwan

fYear

2010

fDate

20-22 Oct. 2010

Firstpage

1

Lastpage

23

Keywords

compression moulding; compression mold development; multiple propose applications; Compounds; Films; Laminates; Plasma temperature; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4244-9783-6

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2010.5699550

Filename

5699550