DocumentCode
2312272
Title
Low bias voltage and high sensitivity CMOS condenser microphone using combined stress relaxation design
Author
Chen, Jien-Ming ; Kuo, Chin-Fu ; Wang, Di-Bao ; Huang, Chin-Wen ; Sun, Shang-Ching ; Hsieh, Yu-Sheng ; Zhon, Wu-Zhong
Author_Institution
South Branch, Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
3
Abstract
During the past decade, many companies have applied MEMS micromachining technique to the fabrication of miniature microphone such as Knowles SiSonicTM, Yamaha, Akustica, and Omron. In addition to the miniature volume, one major advantage that MEMS microphones is the capability of handling the heat produced during the reflow soldering processes on typical surface mount fabrication lines. However, most MEMS microphones are connected to ASIC chips through wire bonding that will induce undesired parasitical capacitance. The requirements of monolithic integration of sensors with electronic part comes form lowing the manufacturing cost, simplifying total process, solving interconnect bottleneck, miniaturizing total size, and reducing the parasitic capacitance. One example is the accelerometer made by Analog Device. A piezoelectric microphone with on-chip CMOS amplifier has been demonstrated. The square diaphragm with the size 2 mm on a side was fabricated by combining a silicon-nitride diaphragm with ZnO thin film layers. The measured sensitivity is 80 uV/Pa at 3 KHz and the frequency response range is form 800 Hz to 30 KHz. The capacitive sensing is more widely used to detected membrane vibration. Condenser microphone has benefits of high sensitivity, flat frequency response, and low noise level. A FET condenser microphone with sensitivity up to 38 mV/Pa had been reported. Basically, the sensitivity of microphone can be boosted by increasing membrane size and bias voltage, reducing the air gap, and relieving the residual stress. To acquire enough bias voltage, the additional charge pump circuit is needed; thus, this additional charge pump circuit will increase the cost and the overall volume of microphone. To this consideration, a low bias voltage with high sensitivity CMOS microphone using combined stress relaxation is developed. The design concept, fabrication processes, and measurement result are proposed in this study.
Keywords
micromachining; microphones; piezoelectric devices; stress relaxation; MEMS micromachining technique; charge pump circuit; combined stress relaxation design; high sensitivity CMOS condenser microphone; low bias voltage; piezoelectric microphone; CMOS integrated circuits; Fabrication; Micromechanical devices; Microphones; Sensitivity; Sensors; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699554
Filename
5699554
Link To Document