DocumentCode :
2312308
Title :
Phase equlibria studies of the Sn-Sb-Ni system at 270°C
Author :
Chen, Yue-ting ; Chen, Chih-chi
Author_Institution :
Dept. of Chem. Eng., Chung Yuan Christian Univ., Chungli, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
The isothermal section of the Sn-Sb-Ni ternary system at 270°C is experimentally determined in this study. Sn-Sb and Sn-Sb-based alloys are viable high-temperature Pb-free solders, and Ni is the most frequently encountered surface finish in microelectronic industry. Sn-Sb/Ni is an important contact in using high temperature solders. Thus, phase equilibria information of the Sn-Sb-Ni ternary system is essential to the development of high-temperature Pb-free solders. 270°C is approximately the reflow temperature of the Sn-Sb solders. It is found that a Sn-Sb-Ni ternary phase, Ni(Sn1-x, Sbx)3 (τ), exists at 270°C, where x=0.5-0.76. Based on the XRD structural determination, the τ phase is with a body-center-cubic (bcc) CoSb3 crystal structure. The liquid phase has 14at%Sb and negligible Ni solubility, and the Rhombohedral-A7 Sb phase has 15at%Sn and negligible Ni solubility. The maximum Sb solubility in the Ni3Sn4 phase is 6.2at%. Six three-phase, 13 two-phase, and 10 single-phase region regions are determined. The six three-phase regions are liquid-Ni3Sn4-τ, liquid-Sn3Sb2-τ, Sn3Sb2-SnSb-τ, SnSb-Sb-τ, Sb-T-NiSb2, and α-Ni7Sb3-β. The 13 two-phase regions are liquid-Ni3Sn4, liquid-τ, liquid-Sn3Sb2, Sn3Sb2-τ, SnSb-τ, Sn3Sb2-SnSb, SnSb-Sb, Sb-τ, Sb-NiSb2, α-β, α-Ni7Sb3, β-Ni7Sb3, and β-Ni3Sn4.
Keywords :
X-ray diffraction; antimony alloys; nickel alloys; phase diagrams; phase equilibrium; solders; solubility; tin alloys; SnSbNi; XRD; high-temperature solders; isothermal section; liquid phase; phase equilibria; solubility; temperature 270 degC; ternary phase; Compounds; Isothermal processes; Nickel; Solids; Tin; X-ray scattering; Sn-Sb-Ni; high-temperature solders; phase equilibria;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699556
Filename :
5699556
Link To Document :
بازگشت