DocumentCode
2312347
Title
A fine line/space fabrication process on flexible polyimide film using laser direct writing method by photothermal effect of silver nanoparticles
Author
Cheng, Yi-Ting ; Uang, Rouh-Huey ; Chiou, Kuo-Chan
Author_Institution
Nano Technol. Res. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear
2010
fDate
20-22 Oct. 2010
Firstpage
1
Lastpage
4
Abstract
This article describes a fine line/space fabrication process on flexible polyimide film using laser direct writing method by photothermal effect of silver nanoparticles. Since the AgNPs have a strong optical absorption at 405 nm, a UV laser (405 nm, 60 mW) is used to trigger AgNPs to convert light into heat due to photothermal effect of nanoparticles. After UV laser beam irradiating on the AgNPs thin film, the AgNPs aggregate into larger conducting grains and improve the adhesion between AgNPs and the polyimide substrate at the same time. Then the desired AgNPs conductive lines (line width: 10 μm, line space: 20 μm) are formed after washing the unirradiated AgNPs. Copper plating is also used to increase the electrical conductivity of the laser direct patterning of AgNPs conductive lines. In this method, the conductive line patterns can be made by a low power consumption process (<; 60 mW) and with high energy transformation efficiency due to photothermal effect of nanoparticles.
Keywords
copper; electroplating; laser beam applications; laser beam effects; light absorption; nanoparticles; photothermal effects; silver; Ag; Cu; UV laser beam irradiation; copper plating; electrical conductivity; fine line; flexible polyimide film; laser direct patterning; laser direct writing; optical absorption; photothermal effect; polyimide substrate; power 60 mW; silver nanoparticles; space fabrication; thin film; wavelength 405 nm; Copper; Films; Laser beams; Nanoparticles; Photothermal effects; Silver; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location
Taipei
ISSN
2150-5934
Print_ISBN
978-1-4244-9783-6
Electronic_ISBN
2150-5934
Type
conf
DOI
10.1109/IMPACT.2010.5699559
Filename
5699559
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