• DocumentCode
    2312347
  • Title

    A fine line/space fabrication process on flexible polyimide film using laser direct writing method by photothermal effect of silver nanoparticles

  • Author

    Cheng, Yi-Ting ; Uang, Rouh-Huey ; Chiou, Kuo-Chan

  • Author_Institution
    Nano Technol. Res. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This article describes a fine line/space fabrication process on flexible polyimide film using laser direct writing method by photothermal effect of silver nanoparticles. Since the AgNPs have a strong optical absorption at 405 nm, a UV laser (405 nm, 60 mW) is used to trigger AgNPs to convert light into heat due to photothermal effect of nanoparticles. After UV laser beam irradiating on the AgNPs thin film, the AgNPs aggregate into larger conducting grains and improve the adhesion between AgNPs and the polyimide substrate at the same time. Then the desired AgNPs conductive lines (line width: 10 μm, line space: 20 μm) are formed after washing the unirradiated AgNPs. Copper plating is also used to increase the electrical conductivity of the laser direct patterning of AgNPs conductive lines. In this method, the conductive line patterns can be made by a low power consumption process (<; 60 mW) and with high energy transformation efficiency due to photothermal effect of nanoparticles.
  • Keywords
    copper; electroplating; laser beam applications; laser beam effects; light absorption; nanoparticles; photothermal effects; silver; Ag; Cu; UV laser beam irradiation; copper plating; electrical conductivity; fine line; flexible polyimide film; laser direct patterning; laser direct writing; optical absorption; photothermal effect; polyimide substrate; power 60 mW; silver nanoparticles; space fabrication; thin film; wavelength 405 nm; Copper; Films; Laser beams; Nanoparticles; Photothermal effects; Silver; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699559
  • Filename
    5699559