Title :
Evaluation of board level reliability of BGAs under thermal cycling test
Author :
Tzeng-Cherng, Luo ; Meng-Chieh, Liao ; Te-Chun, Huang ; Huang Chen-Yu
Author_Institution :
CERL Lab., Inventec Corp. (Taoyuan), Taoyuan, Taiwan
Abstract :
Board level reliability is more representative of the reliability of a package operating in the field and fatigue due to loading with cyclical stresses is a major concern in solder joint reliability. In this paper, the board level reliability of two types of BGA packages CTBGA 228 and CABGA 160 under accelerated temperature cycling stress had been studied; each package contains a daisy chained die. Temperature cycling tests from 0°C to +100°C with 10 min dwell time were conducted to failure for all the package types. The cycle to failure was analyzed using two parameters Weibull distribution and also use Moire interferometry to confirm the test result. From Weibull distribution and Moire interferometry results showed that CABGA 160 has longer reliability than CTBGA 228.
Keywords :
Weibull distribution; ball grid arrays; interferometry; reliability; solders; BGA packages; CABGA 160; CTBGA 228; Moire interferometry; Weibull distribution; accelerated temperature cycling stress; ball grid array; board level reliability; solder joint reliability; temperature 0 degC to 100 degC; thermal cycling test; time 10 min; Integrated circuit reliability; Interferometry; Soldering; Stress; Thermal loading; Weibull distribution; Ball grid array (BGA); Board level reliability; Moire interferometry; Weibull distribution; thermal cycling test;
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2010.5699562
