Evaluation of board level reliability of BGAs under thermal cycling test

Author

Tzeng-Cherng, Luo ; Meng-Chieh, Liao ; Te-Chun, Huang ; Huang Chen-Yu

Author_Institution

CERL Lab., Inventec Corp. (Taoyuan), Taoyuan, Taiwan

fYear

2010

fDate

20-22 Oct. 2010

Firstpage

1

Lastpage

3

Abstract

Board level reliability is more representative of the reliability of a package operating in the field and fatigue due to loading with cyclical stresses is a major concern in solder joint reliability. In this paper, the board level reliability of two types of BGA packages CTBGA 228 and CABGA 160 under accelerated temperature cycling stress had been studied; each package contains a daisy chained die. Temperature cycling tests from 0°C to +100°C with 10 min dwell time were conducted to failure for all the package types. The cycle to failure was analyzed using two parameters Weibull distribution and also use Moire interferometry to confirm the test result. From Weibull distribution and Moire interferometry results showed that CABGA 160 has longer reliability than CTBGA 228.

Keywords

Weibull distribution; ball grid arrays; interferometry; reliability; solders; BGA packages; CABGA 160; CTBGA 228; Moire interferometry; Weibull distribution; accelerated temperature cycling stress; ball grid array; board level reliability; solder joint reliability; temperature 0 degC to 100 degC; thermal cycling test; time 10 min; Integrated circuit reliability; Interferometry; Soldering; Stress; Thermal loading; Weibull distribution; Ball grid array (BGA); Board level reliability; Moire interferometry; Weibull distribution; thermal cycling test;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International

Conference_Location

Taipei

ISSN

2150-5934

Print_ISBN

978-1-4244-9783-6

Electronic_ISBN

2150-5934

Type

conf

DOI

10.1109/IMPACT.2010.5699562

Filename

5699562