An instruction to high thermal conductive materials

Along with the increase in circuit density, it becomes more difficult to dissipate heat through the surface of the components. Therefore, the designs and applications for the materials used in heat dissipation as well as high thermal conductivity and low CTE have become the focal point for discussion. In addition, as the high luminance of LEDs is increased and development for brighter LEDs continues, traditional printed circuit boards are finding it more difficult to catch up with the new thermal management need. As such, metal core PCBs are developed to improve the path of heat dissipation, to increase light emitting efficiency, and extend the service life. We had developed heat dissipation materials for the thermal management of LEDs and MCPCB. Materials are available in thermal conductivity from 1.0W/mK to 3.0W/m.K, but these are not enough to apply to electric devices which require high heat dissipation efficiency. In the next step, We proposed a novel material design to improve the the thermal conductivity of isotropic resins by controlling, high order structures. By mixing this resin with certain kinds of filter (ex. BN) it is enabled to obtain the higher thermal conductive composites, which has not reached by the conventional resin. The composites would be widely applied to the portable´ multi-layered printed circuit boards for automobiles (ex. head light), and street lamp.