A novel highly thermal reliable halogen-free system for copper clad laminates

The developing trend for the high performance electronic devices still focuses on light, thin, short and small exhibiting high heat resistance and multi-functional properties, To meet the above requirements, the copper clad laminate substrate preferably produced from the materials having high thermal resistance, high glass transition temperature and low CTE. For the above purposes, we developed a new halogen-free composition which comprises nitrogen-containing resin, hardener, inorganic filler and phosphorous-containing flame retardant, when the new resin composition is cured, it will import the CCL with excellent physical properties.