DocumentCode :
2312619
Title :
Delamination fracture characteristics for polyimide-related interfaces under fatigue loadings
Author :
Zhu, S.-W. ; Shih, C.-P. ; Chiu, T.-C. ; Shen, G.S.
Author_Institution :
Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
The fracture responses of interfaces under either monotonic or fatigue loading conditions were investigated by using double cantilever beam (DCB) tests. The tests were performed using a custom-developed micro-tester. The applied load vs. interfacial crack opening relationship obtained from the DCB experiment was analyzed by using a beam on elastic foundation-based closed-form expression for determining the critical strain energy release rate or the fatigue delamination growth rate for the interface of interest. From the analysis the relationship between the crack growth rate and the applied strain energy release rate range was determined. For the polyimide-SiN interface, the subcritical fatigue delamination growth rate was found to display a power-law dependence on the applied strain energy release rate range with an exponent of 3.2.
Keywords :
delamination; electronics packaging; fatigue cracks; fracture mechanics; interconnections; mechanical testing; polymers; silicon compounds; DCB; SiN; custom-developed microtester; delamination fracture characteristics; double cantilever beam test; elastic foundation-based closed-form expression; fatigue loading; polyimide-related interface; strain energy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699574
Filename :
5699574
Link To Document :
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