• DocumentCode
    2312784
  • Title

    Silicon micromachined thermal profilers

  • Author

    Gianchandani, Y.B. ; Najafi, K. ; Orr, B.G.

  • Author_Institution
    Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
  • fYear
    1993
  • fDate
    5-8 Dec. 1993
  • Firstpage
    191
  • Lastpage
    194
  • Abstract
    This paper presents a class of scanning thermal profilers micromachined from bulk silicon. Each device consists of an Au-polysilicon thermocouple supported by a probe shank overhanging the edge of the device substrate. The probe shank is suspended by flexural beams and can be electrostatically excited into physical motion by lateral comb drives. A polysilicon heater that can be used to provide a thermal bias during the scan lies at its base. Variations of the basic design include suspension of the thermocouple on a dielectric diaphragm, and replacing the thermocouple by a thermopile. A single-sided, IC-compatible 8 mask process has been developed to fabricate these devices. Preliminary data from test scans obtained using a simple set-up indicates that temperature resolution better than 20/spl deg/mC is possible even with basic silicon shank devices.<>
  • Keywords
    elemental semiconductors; machining; micromechanical devices; semiconductor technology; silicon; temperature measurement; thermocouples; thermopiles; Au-Si; Au-polysilicon thermocouple; IC-compatible 8 mask process; dielectric diaphragm; electrostatically excitation; fabrication; flexural beams; lateral comb drives; micromachined silicon; polysilicon heater; probe shank; scanning thermal profilers; temperature resolution; thermal bias; thermopile; Boron; Fabrication; Force measurement; Glass; Microscopy; Signal design; Silicon; Temperature; Thermal resistance; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
  • Conference_Location
    Washington, DC, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-1450-6
  • Type

    conf

  • DOI
    10.1109/IEDM.1993.347244
  • Filename
    347244