DocumentCode :
2312836
Title :
Highly-selective MOCA lowpass filter designs using glass-based TF-IPD technology
Author :
Lee, Tsaitzu ; Lin, Yo-Shen ; Chen, Chia-Chun
Author_Institution :
Touch Micro-Syst. Technol. Corp., Yangmei, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
In this work, a thin-film integrated passive device (TF-IPD) technology has been developed to meet the requirements of smaller form factor, lower cost, and faster design cycling time in modern RF front-end application. Two very compact and highly-selective TF-IPD lowpass filter designs for the Multimedia over Coax Alliance (MoCA) application are demonstrated. They are required to pass the CATV-band from 50 to 750 MHz, and exhibit very good rejection for frequency higher than 975 MHz. Specifically, the Design 1 has an in-band insertion loss of 1.8d B with more than 40 dB rejection from 975 MHz to 5.8 GHz. On the other hand, the Design 2 with a different layout method and thus different coupling effect has an excellent in-band insertion loss of 1.4 dB and a flat 30 dB stop-band from 1.4 to 4 GHz. It is thus possible to adjust the coupling within the circuit layout to meet different filter specifications. Both designs have chip sizes around 6 mm, which are much smaller than the conventional designs based on discrete components. The proposed highly-selective lowpass filter designs can also be applied to mobile communication devices due to their compact size and good performance.
Keywords :
UHF filters; VHF filters; cable television; low-pass filters; microwave filters; microwave integrated circuits; mobile handsets; passive filters; thin film devices; CATV band; MOCA lowpass filter; Multimedia over Coax Alliance; RF front end application; frequency 50 MHz to 750 MHz; frequency 975 MHz to 5.8 GHz; glass based TF-IPD technology; mobile communication device; thin film integrated passive device; Couplings; Inductors; Insertion loss; Integrated circuit modeling; Layout; Radio frequency; Spirals; MoCA; Thin-film integrated passive device (TF-IPD); glass substrate; lowpass filter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699587
Filename :
5699587
Link To Document :
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