DocumentCode :
2313100
Title :
The impact of fluorine on CMOS channel length and shallow junction formation
Author :
Der-Gao Lin ; Rost, T.A.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fYear :
1993
fDate :
5-8 Dec. 1993
Firstpage :
843
Lastpage :
846
Abstract :
The effects of fluorine on shallow junction formation and CMOS channel length are evaluated in this report. In this study fluorine is implanted into the device LDD region. It was found that fluorine can significantly decrease the device channel length reduction and improve short channel behavior. It was also shown that fluorine can suppress dopant diffusion to form shallower junctions. These results may provide a new approach for relaxing thermal budget constraints and reducing short channel effects for scaling CMOS technologies to smaller dimensions.<>
Keywords :
diffusion in solids; fluorine; insulated gate field effect transistors; ion implantation; semiconductor junctions; CMOS channel length; CMOS technologies; LDD region; Si:F; dopant diffusion; fluorine implantation; scaling; shallow junction; short channel effects; thermal budget; Annealing; Boron; CMOS technology; Implants; Instruments; Ion implantation; Resistors; Silicon; Temperature; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1993. IEDM '93. Technical Digest., International
Conference_Location :
Washington, DC, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-1450-6
Type :
conf
DOI :
10.1109/IEDM.1993.347268
Filename :
347268
Link To Document :
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