• DocumentCode
    2313263
  • Title

    Message from the Chair

  • Author

    McDermid, Bill

  • fYear
    2004
  • fDate
    19-22 Sept. 2004
  • Abstract
    Presents the welcome message from the conference proceedings.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2004. Conference Record of the 2004 IEEE International Symposium on
  • Conference_Location
    Indianapolis, IN, USA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-8447-4
  • Type

    conf

  • DOI
    10.1109/ELINSL.2004.1380369
  • Filename
    1380369
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2313263