• DocumentCode
    2313488
  • Title

    A vibrating micro-resonator design for gyroscope applications using TIA

  • Author

    Chiu, Sheng-Ren ; Chen, Jen-Yi ; Teng, Li-Tao ; Sue, Chung-Yang ; Lin, Shih-Ting ; Hsu, Yu-Wen ; Su, Yan-Kuin

  • Author_Institution
    Microsyst. Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    20-22 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a vibrating micro-resonator using transimpedance amplifier (TIA) for gyroscope applications. First, a gyroscope model is built for sensor design. The critical parameters are optimized by theoretical calculation and fine tuned by finite-element-analysis (FEM). Then, SOG-bulk micromachining and deep reactive ion etching (DRIE) are adopted to fabricate the gyroscope with high aspect-ratio sensing structure and high yield. Finally, an ASIC, TIA with large on-chip transimpedance is developed for driving loop to accomplish a self-oscillated micro-resonator.
  • Keywords
    finite element analysis; gyroscopes; inertial navigation; micromachining; micromechanical resonators; operational amplifiers; sputter etching; SOG-bulk micromachining; deep reactive ion etching; finite-element-analysis; gyroscope applications; transimpedance amplifier; vibrating micro-resonator design; Accelerometers; Application specific integrated circuits; Fingers; Force; Gyroscopes; Resonant frequency; Sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
  • Conference_Location
    Taipei
  • ISSN
    2150-5934
  • Print_ISBN
    978-1-4244-9783-6
  • Electronic_ISBN
    2150-5934
  • Type

    conf

  • DOI
    10.1109/IMPACT.2010.5699632
  • Filename
    5699632