DocumentCode :
2313532
Title :
Galvanostatic electrodeposition of SnCu2–4Ni1–2 as a lead-free solder
Author :
Chen, Jing-Yu ; Tsai, Ho-Cheng ; Wu, Pu-Wei
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear :
2010
fDate :
20-22 Oct. 2010
Firstpage :
1
Lastpage :
4
Abstract :
SnCu2-4Ni1-2 as a lead-free solder was prepared from both sulfate and chloride plating solutions by galvanostatic electrodeposition. Current-potential polarizations for both plating baths were obtained with their respective deposition rates measured. Characterizations including SEM, EDX, and XRD were carried out to obtain relevant materials properties.
Keywords :
X-ray chemical analysis; X-ray diffraction; copper alloys; electrodeposition; nickel alloys; scanning electron microscopy; solders; tin alloys; EDX; SEM; SnCu2-4Ni1-2; XRD; chloride plating solution; current-potential polarizations; galvanostatic electrodeposition; lead-free solder; sulfate plating solution; Copper; Electrodes; Films; Nickel; Tin; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems Packaging Assembly and Circuits Technology Conference (IMPACT), 2010 5th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4244-9783-6
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2010.5699635
Filename :
5699635
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2313532
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